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OEM/ODM High-Tech Manufacturer
Shaping a Sustainable Future for RFID
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RFID Recycled PVC Card
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CLASSIFICATION
Classification
Sustainable card
RFID Recycled PVC Card
RFID PLA Card
RFID PET Card
RFID PETG Card
RFID Wooden Card
RFID Paper Card
RFID Teslin Card
NFC Card
NFC Card
MIFARE Classic®
MIFARE Ultralight®
MIFARE DESFire®
MIFARE Plus®
NXP NTAG®
NXP ICODE®
HITAG®
NXP UCODE®
IMPINJ®
Fudan series
RFID Tags
NFC Tags
RFID Anti-metal Tags
Sustainable RFID Tags
RFID Inventory Tags
RFID Temperature Tags
RFID Industry Tags
Patented product
Fingerprint card
Bluetooth Ibeacon card
BLE Indoor Position card
DA14585 iBeacon card
nRF52832 iBeacon card
Batteryless Eink Tags
RFID Blocking card
Visual Cold Wallet Card
Featured Card
Polycarbonate White Card
Featured cards
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RFID NXP Ntag Inlay
Quick
preview
RFID NXP Ntag Inlay
Working temperature
-20℃-75℃ (humidity 20%~90%)
Storage temperature
-40-70℃ (humidity 20%~90%)
Communication protocol
ISO14443A
Surface material
coated paper, PVC, PET
Reading and writing distance
3-10CM (with corresponding power reading and writing equipment)
Packaging process
flip chip soldering + composite
Packaging material
Ntag Inlay + base-free double-sided tape + release paper
RFID PCB Anti-metal Tags
Quick
preview
RFID PCB Anti-metal Tags
Size
42x15mm, hole diameter 4mm*2
Material
PTFE
Colour
Black
Installation method
Glue or screws
Protocol
EPC Class1 Gen2, ISO18000-6C
Frequency
(American Standard) 902-928MHZ, (European Standard) 865-868MHZ
Chip
Alien Higgs-4
RFID UHF Anti Liquid Tag
Quick
preview
RFID UHF Anti Liquid Tag
Protocol
ISO/IEC 18000-6C / EPC global Class 1 Gen 2
Chips
Impinj Monza 4E
Service life
Data retention for 10 years
Chip parameters
EPC: Up to 496Bits User Memory: 128Bits TID: 48Bits Unique TID: 48Bits Access Password: 32Bits Kill Password: 32Bits
Storage environment
Anti-static packaging +25°C /40%RH
Storage temperature
[-25°C~+50°C]20%~90%RH
Operating temperature
[-40°C~+70°C]20%~90%RH
RFID Ultralight Inlay
Quick
preview
RFID Ultralight Inlay
Working temperature
-20℃-75℃ (humidity 20%~90%)
Storage temperature
-40-70℃ (humidity 20%~90%)
Communication protocol
ISO14443A
Surface material
coated paper, PVC, PET
Reading and writing distance
3-10CM (with corresponding power reading and writing equipment)
Packaging process
flip chip soldering + composite
Packaging material
Mifare Ultralight series Inlay + base-free double-sided tape + release paper
RFID PCB Anti-metal Tags
Quick
preview
RFID PCB Anti-metal Tags
Size
5mmxT4.0mm
Colour
Black
Chip
Alien Higgs-3; NXP UCODE8
Frequency
(American Standard) 902-928MHZ, (European Standard) 865-868MHZ
Weight
0.5g
Applications
Asset managements, etc
RFID I-CODE Inlay
Quick
preview
RFID I-CODE Inlay
Working temperature
-20℃-75℃ (humidity 20%~90%)
Storage temperature
-40-70℃ (humidity 20%~90%)
Communication protocol
ISO14443A
Surface material
coated paper, PVC, PET
Reading and writing distance
3-10CM (with corresponding power reading and writing equipment)
Packaging process
flip chip soldering + composite
Packaging material
I-CODE Inlay+ base-free double-sided tape + release paper
RFID Traceability Tags
Quick
preview
RFID Traceability Tags
Protocol
UHF ISO18000- 6C
Frequency
915MHz (860-960MHz)
Working temperature
-20/+50℃ (humidity 20%~100%)
Storage temperature
-40/+70°C (humidity 20%~100%)
Rear & Write distance
0.2-8M (with corresponding power reading and writing equipment)
Packaging material
PVC+aluminum etching+adhesive (printable, printable)
Chip model
lmpinj(M4, M4E, MR6, M5), Alien(H3, H4)
RFID PCB Anti-metal Tags
Quick
preview
RFID PCB Anti-metal Tags
Size
42x15mm, hole diameter 4mm*2
Frequency
902-928MHz
Reading distance (4W fixed machine)
more than 3 meters (4W EIRP, using impinj fixed reader, if other readers, the reading distance may be different)
Installation method
Can be mounted on metal surfaces
Protocol
EPC Class1 Gen2, ISO18000-6C
RFID S50 Inlay
Quick
preview
RFID S50 Inlay
Working temperature
-20℃-75℃ (humidity 20%~90%)
Storage temperature
-40-70℃ (humidity 20%~90%)
Communication protocol
ISO14443A
Surface material
coated paper, PVC, PET
Reading and writing distance
3-10CM (with corresponding power reading and writing equipment)
Packaging process
flip chip soldering + composite
Packaging material
S50 Inlay + base-free double-sided tape + release paper
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