A patented advanced lamination process to package different types of PCBA with components such as BLE module or fingerprint sensor, or battery under perfectly contolled temperature or pressure into banking card size or any shape or design.
Introduction to Cold Lamination Technology
OEM/ODM Processing/ Lamination/Integration for Active Electronic Smart Card of
biometric/authentic/IOT/OTP/FP developer Board
Key features:
✅ Ultra-Thin & Flexible – Credit-card thickness (<2mm)
✅ Customizable Integration – Supports BLE, NFC, RFID, LEDs, sensors, and embedded ICs (e.g., payment chips).
✅ Cost-Effective Production – No high-temperature or pressure curing
✅ Zero Mold Costs – No expensive injection molds required, no minimum order quantity (MOQ).
✅ Fast Turnaround – From design to mass production in just days, helping you seize market opportunities.
✅ Full Customization – Supports any shape, size, or printed design for branding or creative needs.
✅ Ultra-Portable – Credit-card size or custom dimensions, fits easily in wallets/cardholders.
Specifications
It supports unique identifier (UID) and MIFARE Plus SE as an identification method, and is compatible with most existing RF terminals on the market.
Consumer Electronics - Bluetooth trackers, BLE Beacon, Fingerprint Smart Card, Find My Air Card Tracker, Digital (Crypto) Hard Wallet, Smart Keychains, mini GPS locators and so on.
Promotional Gifts - Custom-printed designs for low-cost, high-impact branded giveaways
