UHF Wet Inlay is an ultra-high frequency that is die-cutting after the dry Inlay is covered with a layer of self-adhesive. Besides thickness, the wet Inlay has its own die-cutting dimensions. The wet Inlay generally has a thickness of 0.15±0.04 mm.

HF dry Inlay is made up of an aluminum-etched antenna and 13.56MHz chip. HF dry Inlay is without glue and the overall thickness is 0.07mm±0.005mm.

The NFC Ntag Chip Inlay platform is based on industry standards close to ISO/IEC 14443 and includes tag IC that conform to NFC Forum tag type 2 and tag type 4, with a working range of up to 10 cm.

S50 Inlay uses NXP Mifare S50Inlay+ substrateless double-sided adhesive + release paper in accordance with the IEC/ISO 14443A air interface protocol. It has advanced data encryption and two-way password verification system,

HF wet inlay is formed by die-cutting after the dry Inlay is covered with a layer of self-adhesive. In addition to the thickness, the wet Inlay also has its own die-cutting dimensions.