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RFID Dry inlays
production intruduction RFID Dry inlays / RFID Labels Specifications: Module Type : HF chip: NXP Mifare 1k(S50)4K(S70),Mifare Ultralight, Mifare Desfire EV1 4k, Mifare Desfire EV18k, FM11RF08(F08)--Mifare 1k(s50) compatible, TKS50--Mifare 1...

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production intruduction

RFID Dry inlays / RFID Labels
 
Specifications:
Module Type
:
HF chip: NXP Mifare 1k(S50)4K(S70),Mifare Ultralight,
Mifare Desfire EV1 4k, Mifare Desfire EV1 8k,
FM11RF08(F08)--Mifare 1k(s50) compatible,
TKS50--Mifare 1k(s50) compatible,etc-----compliant with ISO14443
NXP Mifare ICODE SLI-L(512bit),
ICODE SLI(1024bit), ICODE SLI-S(2048bit)
-----compliant with ISO15693
UHF Chip: Alien H3, Impinj M5,etc
-----compliant with EPC18000-6C and EPCglobal Class 1 Gen 2
Antenna:
 
HF: AL Etching, Ultrasonic Embedding;
UHF: AL Etching
Material
:
Paper/PVC/ PET or Others on request
Format
:
 Can be customized per your demand
Frequency
:
HF: 13.56MHz, UHF: 860MHz-960MHz
Bonding
:
HF: FLIP chip, MOA2,
UHF: Flip chip
Working Temperature
:
-25℃ ~ +65℃ based on encapsulating material
Available Craft
:
Printing, custom logo, barcode, serial numbers,
UID Write Code and etc.         
Features
:
1. Small size, easy to carry
2. Can be packed in different types
4. Anti-interference
Applications
:
Access control system, Library management, 
Ticket and transportation, Logistics, 
Electrical equipment tracking and etc.
Specifications are subject to change without notice.
 
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