OEM/ODM Cold Laminating Technology
OEM/ODM Processing/ Lamination/Integration for Active Electronic Smart Card of biometric/authentic/IOT/OTP/FP developer Board
Introduction to Cold laminating Card
The cold laminating card adopts low temperature lamination technology (cold lamination technology). The internal structure of the cold laminating card is mainly composed of PCB circuit board, lithium polymer battery, IC integrated chip, and Bluetooth function module.
Function introduction:
The working status of the card can be controlled through the Bluetooth connection of the mobile phone, and the security information and consumption information of the card can be grasped at any time.
Fingerprint card Payment Solutions
√ EMV Level test ongoing
√ Embedded Condition : Algorithm based
√ No Battery, No Supercapacitor with ISO standard
√ Thin thickness : 0.8 mm after Lamination
√ Co-work with Global Credit Card
√ Dual Interface fingerprint smart card
ID Card Solutions
√ Able to provide SE MCU level for high security performance
√ Able to provide NFC level for faster performance
√ Embedded Condition : Algorithm based
√ No Battery, No Supercapacitor with ISO standard
Product Description
√ Sensor Pixel size : 131x132
√ Sensor Resolution: 350dpi
√ Module size : 81 x 49(mm)
√ Secure Element MCU
√ Dual Interface
√ No Battery
√ No Supercapacitor
Fast performance
√ Authentication Speed : ~ 0.7s (max), 0.5s (avg)
√ Template size : 0.5k per 1 ID
Thanks to our advanced cold lamination technology, it is easy to ensure the fingerprint inlay performance and laminate into thin card of CR80 size.
Spec. |
UIF300 Module (Flexible) |
Sensor Pixel |
131 x 132 |
Sensor Resolution |
350dpi |
Sensor Size |
14.7 x 14.7 x 0.6mm |
Algorithm MCU |
Cortex-M4 |
Response Time |
600ms |
FAR (False Acceptance Rate) |
< 0.001% (Security Level 3) |
FRR (False Rejection Rate) |
< 1% (Security Level 3) |
Fingerprint Capacity |
< 5 |
Communication I/F |
ISO7816 & I2C |
Operating Voltage |
+2.5V or +3.3V |
Standby Current |
< 1mA |
Operating(Match) Current |
< 8mA |
Operating Temp. |
-10°C ~ +50°C |
Module Size |
81 x 49mm |
Lamination |
85.6 x 53.8mm (ISO 7816) |
Recognition distance |
2cm (contactless) / HID OMNIKEY5421 |
Strong Point |
No Battery, No Supercapacitor |
Some Solutions You Can Choose
1. Customers provide a complete set of Circuit Boards and Components, and our company is responsible for Packaging into cards
2. The customer provides the Main Components, BOM list and Design Principles. Our company is responsible for PCB design other components procurement,PCB production, component patch welding, and finally packaging into cards
3. Customers provide design ideas,all other processes are completed by our company.
Remarks: Our fingerprint smart card could be used for high secured access control and payment which could store biometric data and personal data.
Process Comparison of Cold Laminating Card and Traditional Injection Card
|
Cold Laminating Card |
Traditional Injection Card |
Cost of production |
1. Low cost
2. Suitable for small batch diversified production needs
|
Tens of thousands of mold fees |
Card thickness |

1.The card is thin
2.The general thickness is 0.84-1.6mm
3.Easy to carry and use |

1. 3-8mm |
Card Size |
 |
 |
Layout printing |
The surface of the card is suitable for printing in various colors, and like the credit card |
screen printing only |
Wastage |
1. It can be laminated at 50 ℃, and has no effect on the temperature of electronic components and batteries.
2. High temperature resistant materials are used on both sides of the circuit board to effectively isolate the higher temperature battery and impact of the life of electronic components. |
Can not effectively isolate the outside temperature, traditional lamination is easy to cause the battery and electronic components over temperature high and damaged.
|
What the Cold laminating technology can do
Cold laminating equipment
Professional Processing Package: Financial Visual Card, electronic wallet, digital RMB, electronic cold chain wallet, Block Chain Card, Bluetooth visual card, etc. .